For the examination of all the components present in your chamber or evolved from your system

CVD / PECVD / RIE / LPCVD / MOCVD Vacuum Coating / Plasma Etching Sputter Deposition Contamination Studies Base Pressure Fingerprint Leak Detection / Virtual Leaks / desorption Outgassing / Bakeout / Pump Performance Chamber / Process gas contaminants

The HPR-30 process gas analysis system is a compact gas analysis system for monitoring residual gases and vacuum processes, featuring:

• Compact bench-top / mobile cart / console rack construction.
• Direct re-entrant orifice with differential pumping for optimum sensitivity / response.
• Process pressure range from 1 mbar to 10^-4 mbar.
• High Sensitivity (to 5 ppb), mass range options to 1000 amu.
• Soft Ionisation for the analysis of complex organics / appearance MS studies.
• Stability (less than ±0.5% height variation over 24 h).
• MASsoft control via RS232, RS485 or Ethernet LAN.
• Pneumatic valve control for automatic operation with manual override and fail-safe isolator in case of power failure or overpressure.
• Automated simultaneous data acquisition / analysis with local display alarm panels.

Hiden HPR-30 Series Process Gas Analysers (1143K)

 Mass Spectrometers for Thin Films, Plasma and Surface Engineering (1.1MB)

 AP0002 - Surface Characteristics of Parylene-C Films in an Inductively Coupled O2/CF4 Gas Plasma

Posters

 Partial Pressure Control in Reactive Sputtering (343K)

Presentations

 HPR30 Monitoring TiN Depsoition (113K)

 HPR30 Series Orifice Sampling Process Gas Analysers (358K)

Application Notes

 HPR-30 Series for Process Characterisation (121K)

 Partial Pressure Control in Reactive Sputtering (200K)