We are excited to announce that our agents at Scinco will be attending the 22nd International Symposium on Microelectronics and Packaging (ISMP), joined with the 18th International Conference on Reliability and Stress-Related Phenomena in Nanoelectronics (IRSP). The event will take place from November 5-8, 2024, at the Paradise Hotel in Busan, Korea.
At ISMP-IRSP 2024, Scinco will promote Hiden’s advanced products and solutions that support the latest innovations in microelectronics, packaging, and nanoelectronics. This prestigious event provides an opportunity for professionals and researchers in the field to explore cutting-edge technology and discuss the latest trends in reliability and stress-related phenomena.
Make sure to visit Scinco at the conference to learn more about how Hiden’s products can support your work!
Visit Conference Website: click here
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