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How microalloying of the Al target can improve process and film characteristics of sputtered alumina

Surface & Coatings Technology 2020, 393, 125762. https://doi.org/10.1016/j.surfcoat.2020.125762

The Hiden ESPion system was used to investigate the effect of microalloying of the Al target with Cr, W, Mo & Nb elemental additions on the reactive DC sputter deposition of Alumina films. Characteristic reductions in plasma potential for each elemental addition were measured directly using the Hiden ESPion system.  This data was used to determine the deposition rate and target behaviour that each element imparted onto the plasma.  Data showed that alloy additions of Cr, Mo & W improved the sputtering process by reducing arcing at the target, with Cr additions in particular found to be effective at promoting crystalline regions at the Si substrate surface.

Floating potential Uf based on Langmuir wire probe measurements during sputtering the unalloyed Al target and the Al0.98Cr0.02, Al0.98Mo0.02, Al0.98W0.02, and Al0.98Nb0.02 targets at various fO2 values.

Figure 2. Floating potential Uf based on Langmuir wire probe measurements during sputtering the unalloyed Al target and the Al0.98Cr0.02, Al0.98Mo0.02, Al0.98W0.02, and Al0.98Nb0.02 targets at various fO2 values.

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