Selective etching of (Ba,Sr)TiO3 thin films over silicon in an inductively coupled plasma.
Quantitative control of etching reactions on various SiOCH materials.
Plasma etching selectivity of ZrO2 to Si in BCl3/Cl2 plasmas.
Plasma etching of high dielectric constant materials on silicon in halogen chemistries.
Measurements of neutral and ion composition, neutral temperature, and electron energy distribution function in a CF4 inductively coupled plasma.
Mass spectrometry studies of resist trimming processes in HBr/O2 and Cl2/O2chemistries.
Magnetized inductively coupled plasma etching of GaN in Cl2/BCl3 plasmas.
Ion-enhanced chemical etching of HfO2 for integration in metal–oxide–semiconductor field effect transistors.
Ion energy distributions and optical emission spectra in NF3-based process chamber cleaning plasmas.