Plasma Deposition: Magnetron Sputtering

The term ‘plasma deposition’ encompasses various vapor deposition techniques that make use of plasma to deposit a ‘source’ material onto a substrate. Such techniques are commonly used to enhance surface properties such as hardness, chemical resistance, and adhesion; or to impart specific optical or electronic properties.

Magnetron Sputtering

Magnetron sputtering is a deposition technique in which a plasma (typically an inert gas such as argon) is magnetically confined around a ‘target’ of source material deposited onto a substrate. High energy ions in the plasma erode the target, liberating atoms from its surface. Liberated atoms, which are electrically neutral and able to escape the magnetic field, are then deposited onto the substrate, forming a thin film.

Typical magnetron sputtering processes are performed in a high vacuum environment to minimize contaminants’ presence. Confining the plasma around the target using strong magnetic fields enables more ionizing collisions between plasma electrons and gaseous neutrals near the target’s surface, increasing plasma density and producing a higher deposition rate. Also, the confinement of electrons in the plasma prevents damage caused by these electrons’ direct impact with the substrate or growing film.

Wear-resistant coatings, corrosion-resistant films, dry film lubricants, and optical and decorative films are among the typical DC magnetron sputtering applications.

Analytical Tools for Magnetron Sputtering Applications

The development of effective magnetron sputtering processes relies on accurately measuring plasma parameters like composition, density and ion energy. The Hiden EQP mass spectrometer is optimized for plasma analysis, making it the ideal tool for correlating plasma conditions in magnetron deposition processes with the properties of the resultant films achieved.